- Добавил: alex66
- Дата: 7-10-2018, 20:06
- Комментариев: 0

Название: Advances in Chemical Mechanical Planarization (CMP)
Автор: Edited by Suryadevara Babu
Издательство: Woodhead Publishing
Год: 2016
Формат: PDF
Страниц: 538
Для сайта: vtome.ru
Размер: 22,12 МБ
Язык: English
Advances in Chemical Mechanical Planarization (CMP) provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The technology has grown to encompass the removal and planarization of multiple metal and dielectric materials and layers both at the device and the metallization levels, using different tools and parameters, requiring improvements in the control of topography and defects.