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Название: Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture
Автор: E.-H. Wong and Y.-W. Mai
Издательство: Woodhead Publishing
Год: 2015
Формат: PDF
Страниц: 477
Для сайта: vtome.ru
Размер: 25,44 MB
Язык: English
Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture discusses how the reliability of packaging components is a prime concern to electronics manufacturers.
The text presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques.