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Автор: Beth Keser (Editor), Steffen Kroehnert (Editor)
Издательство: Wiley-IEEE Press
Год: 2019
Формат: True PDF
Страниц: 564
Размер: 13.2 Mb
Язык: English
Examines the advantages of Embedded and FO-WLP technologies, potential application spaces, package structures available in the industry, process flows, and material challenges
Embedded and fan-out wafer level packaging (FO-WLP) technologies have been developed across the industry over the past 15 years and have been in high volume manufacturing for nearly a decade. This book covers the advances that have been made in this new packaging technology and discusses the many benefits it provides to the electronic packaging industry and supply chain. It provides a compact overview of the major types of technologies offered in this field, on what is available, how it is processed, what is driving its development, and the pros and cons.