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Название: Electronic Packaging Science and Technology
Автор: King-Ning, Chih Chen, Hung-Ming
Издательство: Wiley
Год: 2022
Формат: PDF
Страниц: 317
Размер: 24 Mb
Язык: English
Must-have reference on electronic packaging technology!
The electronics industry is shifting towards system packaging technology due to the need for higher chip circuit density without increasing production costs. Electronic packaging, or circuit integration, is seen as a necessary strategy to achieve a performance growth of electronic circuitry in next-generation electronics. With the implementation of novel materials with specific and tunable electrical and magnetic properties, electronic packaging is highly attractive as a solution to achieve denser levels of circuit integration.
Автор: King-Ning, Chih Chen, Hung-Ming
Издательство: Wiley
Год: 2022
Формат: PDF
Страниц: 317
Размер: 24 Mb
Язык: English
Must-have reference on electronic packaging technology!
The electronics industry is shifting towards system packaging technology due to the need for higher chip circuit density without increasing production costs. Electronic packaging, or circuit integration, is seen as a necessary strategy to achieve a performance growth of electronic circuitry in next-generation electronics. With the implementation of novel materials with specific and tunable electrical and magnetic properties, electronic packaging is highly attractive as a solution to achieve denser levels of circuit integration.