Название: From 2D to 3D Photonic Integrated Circuits
Автор: Yasha Yi
Издательство: Springer
Год: 2026
Страниц: 214
Язык: английский
Формат: pdf (true), epub
Размер: 29.5 MB

The integration of photonics and electronics has transformed the landscape of modern technology. At the forefront of this revolution is the development of Photonic Integrated Circuits (PICs). Historically rooted in the traditional 2-D fabrication processes inherited from electronic Integrated Circuits, PICs shifted to 3-D configurations, introducing new design philosophies that impact scalability, efficiency, and performance. This convergence of electronic and photonic circuits presents unique challenges and great opportunities.

This book provides an introduction to photonic integrated circuits and the transition from 2D to 3D PICs. It then describes design and fabrication techniques of 3D PICs and related challenges and solutions. Finally, applications of 3D photonics, emerging technologies and industry outlook are also discussed.

The rapid evolution of photonic integrated circuits (PICs) has played a transformative role in advancing modern technologies, from telecommunications and artificial intelligence to quantum computing and biomedical sensing. Over the past few decades, photonics has emerged as a disruptive force, offering high-speed, low-power, and compact solutions that complement or even surpass electronic circuits in various applications. The transition from two-dimensional (2D) photonic integration to three-dimensional (3D) photonic integration marks a pivotal shift in the way we design, manufacture, and implement photonic devices. As industries seek greater performance, efficiency, and scalability, 3D photonics presents itself as a compelling solution, pushing the boundaries of what is possible in optical technologies.

This book serves as both an introduction and an advanced reference for researchers, engineers, and students working in photonic integration, microelectronics, and semiconductor manufacturing. By merging foundational principles with real-world applications, this work provides a comprehensive exploration of the challenges, breakthroughs, and future directions of 3D photonic integrated circuits. The interdisciplinary nature of photonic integration requires expertise in materials science, nanofabrication, optical physics, and electrical engineering, making this a field that bridges multiple scientific domains. The aim of this book is to not only present cutting-edge advancements in 3D photonics but also to offer insights into the practical implementation and commercial impact of these technologies.

The transition to 3D photonic architectures has also introduced new challenges, including fabrication scalability, alignment tolerances, and thermal dissipation, all of which are explored in depth throughout this book. Additionally, we highlight the latest breakthroughs in photonic packaging, co-integration with CMOS electronics, and the potential of neuromorphic photonic computing.






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