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Interconnect Technologies for Integrated Circuits and Flexible Electronics

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  • Дата: 22-09-2023, 20:02
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Название: Interconnect Technologies for Integrated Circuits and Flexible Electronics
Автор: Yash Agrawal, Kavicharan Mummaneni, P. Uma Sathyakam
Издательство: Springer
Серия: Springer Tracts in Electrical and Electronics Engineering
Год: 2024
Страниц: 286
Язык: английский
Формат: pdf (true), epub
Размер: 50.3 MB

This contributed book provides a thorough understanding of the basics along with detailed state-of-the-art emerging interconnect technologies for integrated circuit design and flexible electronics. It focuses on the investigation of advanced on-chip interconnects which match the current as well as future technology requirements. The contents focus on different aspects of interconnects such as material, physical characteristics, parasitic extraction, design, structure, modeling, machine learning, and neural network-based models for interconnects, signaling schemes, varying signal integrity performance analysis, variability, reliability aspects, associated electronic design automation tools. The book also explores interconnect technologies for flexible electronic systems. It also highlights the integration of sensors with stretchable interconnects to demonstrate the concept of a stretchable sensing network for wearable and flexible applications. This book is a useful guide for those working in academia and industry to understand the fundamentals and application of interconnect technologies.

Interconnects have become essentially important in integrated circuit (IC) and printed-circuit board (PCB) designs. In the present state-of-the-art technologies such as network-on-chip, system-on-chip and 3D staggered integrated circuit designs, interconnects constitute large portion of the entire system. Interconnects dominantly control the signal integrity and are the major source for causing latency, crosstalk and power dissipation in the system. These non-idealities exaggerate deeper in nanotechnology dimension nodes as technology scales down.

In an advent to improve the performance of these systems, exploration of emerging on-chip/off-chip interconnects has become highly important. This book is dedicated towards investigation and modelling of advanced interconnects that can suitably match the current as well as future technology requirements. Different aspects of interconnects such as materials, its physical characteristics, parasitic extraction, design, structure, modelling, machine learning and neural network-based models, signalling schemes, crosstalk, signal integrity performance analysis, variability, reliability and associated electronic-design automation tools are explored and systematically detailed.

The book also covers interconnect technologies for flexible electronic system. The flexible electronics have gained much importance in today’s electronic industry and are expected to cover a major portion of all consumable electronic products in near future. The interconnect technology for flexible electronics system design is highly vital and different from the traditional rigid-based interconnects those are laid over the hard bound PCBs. The flexible electronics-based systems require assimilation of advanced designs such as stretchable interconnects. These require different sets of materials, fabrication process as well as consideration of new added design parameters such as elasticity, twisting, folding and bendability. In order to realize a wide range of applications where stretching movements are prevalent, such as wearable healthcare monitoring, flexible electronic systems comprising of stretchable interconnects are essential. The research in flexible electronics and stretchable interconnects have progressed gradually over time. However, hunt for sustainable flexibility and improved electrical performance still offers a vast field of research and opportunities to potential researchers.

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