Название: Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore
Автор: Hengyun Zhang, Faxing Che
Издательство: Woodhead Publishing
Год: 2020
Страниц: 427
Язык: английский
Формат: pdf (true)
Размер: 25.2 MB

Modeling, Analysis, Design and Testing for Electronics Packaging Beyond Moore provides an overview of electrical, thermal and thermomechanical modeling, analysis, design and testing for 2.5D/3D. The book addresses important topics, including electrically and thermally induced issues, such as EMI and thermal issues, which are crucial to package signal and thermal integrity. It also covers modeling methods to address thermomechanical stress related to the package structural integrity. In addition, practical design and test techniques for packages and systems are included.

Key Features
Includes advanced modeling and analysis methods and techniques for state-of-the art electronics packaging
Features experimental characterization and qualifications for the analysis and verification of electronic packaging design
Provides multiphysics modeling and analysis techniques of electronic packaging